| 摘要 |
PURPOSE:To improve the heat dissipating effect and airtightness of a semiconductor integrated circuit (IC) using a ceramic dual inline package by providing a cooling piece extending externally from a chip connector through a thermal conductor at the semiconductor IC and perforating openings at the thermal conductor of the sealed portion of the package. CONSTITUTION:A metal plate such as kovar or the like is stumped to form an electrode terminal unit 16, and T-shaped cooling pieces 23 are continuously formed through a thermal conductor 21 at the right and left sides of a chip connector 20 as a center. Openings 22 are perforated at the thermal conductor 21. Coupling branches 24 are connected to both sides of the thermal conductor 21, and electrode terminals 18 are connected to cantilevers 23 for coupling the branchers 24, respectively. A semiconductor chip 15 is connected through solder 12 to the connector 20, connected through lead wires 17 to the terminals 18, upper and lower ceramic units 19 and 14 are coated thereon and sealed with solder 13. Thus, the upper and lower units 19 and 14 are tightly coupled through the openings of the thermal conductor with the solder so that generated heat may be dissipated through the thermal conductor by the cooling piece. |
