| 摘要 |
<p>In a method of manufacturing an electrical device, comprising the steps of moulding an electrically insulating material housing about portions of an electrically conductive lead frame, with terminal portions of the lead frame extending into a cavity in the housing, and mounting an electrical component in the cavity in the housing with contacts on the component electrically connected to the terminal portions of the lead frame in the cavity, the terminal portions of the lead frame are resilient and initially extend across the cavity in the housing such that on insertion of the component into the cavity the terminal portions of the lead frame are deformed to resiliently grip the contacts on the component and thus provide electrical connections between the component and the lead frame and retain the component in the cavity in the housing.</p> |
