| 摘要 |
PURPOSE:To prevent the deformation and contact of the lead by connecting it to a package or the wiring pattern of the circuit board maintaining a given with the outside end of the lead fixed on the fine piece of the insulated film. CONSTITUTION:A rectangular element housing hole 14 is provided on the polyimide film 1 while notchs 11 are provided at four corners. A copper foil provided on the surface thereof undergoes a photoetching in a specified shape and given a non-electrolyte plating to make a lead 6. A metal bump of a semiconducor elememt 7 is connected to the tip of the lead 6 projected toward a hole 14 under pressure and heat. Then, the lead 6 is cut together with the film 1 outside each side of the hole 14 as well as inward from the extreme end of the notch, bent with the section attached by a strip 12 of the film, and connected to the wire pattern 10 such as seramic substrate by pressing under heat. In this method, the deformation of the lead and the deviation of the pitch can be eliminated thereby facilitating the positioning and improving the working efficiency. |
