| 摘要 |
PURPOSE:To uniformly coat a resist and enhance the accuracy of a semiconductor producing process by feeding inert gas to the back side of a substrate or the like to be coated with the resist to prevent adhesion of the liquid agent to the back side by scattering it horizontally. CONSTITUTION:An upper portion of spinner head 2 set on rotary shaft 1 is provided with vacuum chuck 3, and silicon wafer 4 is held by suction of the portion. Head 2 has inert gas blow holes 5 at its upper edge portion to blow up inert gas toward the back side of the substrate under a predetermined press. When resist 6 is dropped onto the substrate fixed on head 2 by vacuum suction, an excess of the liquid agent is removed horizontally with inert gas currents and discharged from discharge outlet 7. Thus, the liquid agent such as resist 6 can be coated uniformly without adhesion to the back side. |
