| 摘要 |
PURPOSE:To enhance the reliability of a semiconductor element by providing electrically connecting projections on a tape carrier to eliminate the formation of a bump electrode at the element side as unnecessary to prevent the adverse affection of plating to the chip upon formation of the bump. CONSTITUTION:A photoresist 5 is coated on the surface of a tape carrier substrate coated with a conductor layer 6 on a polyimide film 7. Then, a pattern 5' by photoresist is formed on the back surface of the layer 6, and dipped in an etching solution to etch half the thickness of the layer 6. Then, a lead pattern 9 corresponding to the projections on the back surface is formed on the resist on the front side of the layer 6. A coating agent 10 is coated on the back surface of the layer 6 to etch the layer 6, and connecting terminal 12 is formed with projections for electrically connecting the terminal. |
