| 摘要 |
<p>PURPOSE:To eliminate the need for exchanging 4 alignment plates according to a change in the form of a semiconductor chip by a method wherein are respectively modified protrusion lengths of the 4 alignment plates to a block, to which the plates are mounted independent of one another. CONSTITUTION:As the title alignment device is formed into a constitution, wherein each alignment plate of 4 alignment plates 32X1, 32X2, 34Y1 and 34Y2 is modified its protrusion length to a block, to which the 4 plates are mounted individually, independently of one another, the paltes are not necessarily exchanged according to a change in the form of a semiconductor chip (m). For example, the plates 32X2 and 34Y2 for pressing energized by compression coiled springs 25X2 and 31Y2 on a weak side are separated from the chip (m) earlier than the reference plates 32X1 and 34Y1 energized by compression coiled springs 25X1 and 31Y1 on a strong side. Accordingly, the chip (m) subsequent to a positioning is never caused a passional deviation on a chip attracting face 6d due to the separation and movement of the plates and the chip (m) is maintained in an accurate positioning state in its X and Y directions.</p> |
