| 摘要 |
<p>Combined soldering instrument and desoldering attachment comprises an instrument having a heater sleeve which is surrounded by a housing so as to defins a solder receiving chamber which communicates with a vacuum source. A filter screen is spaced within the housing forwardly of a vacuum tube and a vented solder baffle ring rests against the front of the screen. A hollow desoldering tip is supported for axial movement within a head portion of the instrument and communicates with the housing sleeve interior. A portion of the tip provides a stop for the heater sleeve. The angular position of the tip is adjustable w.r.t. the vacuum tube posn. Adjustment of the soldering tip permits proper alignment of the vaccum pipe and instrument tip. The combined appts. is easy to clean.</p> |
