发明名称 WAFER CHUCK
摘要 <p>PURPOSE:To ease maintenance by a long-lived claw without adhesion of deposition which is a dust producing source in wafers and a claw contact part holding the wafers by fixing the two taper claws on a claw body so that a taper face is made an acute angle with a wafer holding face of the chuck body. CONSTITUTION:A chuck body 1 holding wafers 3, a means 4 for rotating the chuck body at the direction of a wafer face and a pushing-out pin 7 for pushingout the wafers 3 from the chuck body 1 are provided, the wafers 3 are carried in a horizontal position and treatment is performed in a vertical position. In regard to a wafer chuck, two taper claws 2 are fixed on the chuck body 1 so that a taper face is made an acute angle to a wafer holding face of the chuck body 1, and the wafers 3 are held between the taper face and the chuck body 1. Thus, deposition flying on the surface of the wafers 3 is accumulated at the outside of the taper claw 2. Therefore, dust does not generate when the wafers are attached and detached because deposition is accumulated on the inside taper part.</p>
申请公布号 JPH01187938(A) 申请公布日期 1989.07.27
申请号 JP19880013138 申请日期 1988.01.22
申请人 FUJITSU LTD;KYUSHU FUJITSU ELECTRON:KK 发明人 KOBAYASHI SHIGEKI;ISHIDA SEIJI
分类号 H01L21/677;H01L21/68;H01L21/683 主分类号 H01L21/677
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