| 摘要 |
PURPOSE:To eliminate waste of material by a method wherein a wire supporting rod is provided above the portion in which wiring is to be completed so as to adjust the height of a connecting wire loop and minimize the length of the connecting wire. CONSTITUTION:After pressure welding the tip of a wire 1 drawn out of a capillary 5 to the point on a semiconductor at which the wire is connected, the capillary is raised to a suitable height. Next a supporting rod 6 set to the position corresponding to the height of a wire loop and the distance between both the connecting points is automatically sent out to a space above and between the wire 1 and the next element 4, making the wire 1 touch the supporting rod 6 in order to move the capillary 5 to the destination of the element 4 and press-weld the wire to the element. At this time, the height of the wire loop and its shape can freely be adjusted according to the set position of the supporting rod 6, and the length of the wire can suitably be shortened. By this constitution wiring work can readily be done, and it is advantageous to adjust inductance. |
