发明名称 Sandwich construction stacked plate capacitor - has dielectric pieces individually formed by heating and compressing to produce dielectric thickness required
摘要 <p>The method is for producing a plate capacitor comprises stamping two capacitor plates (1, 2) from a sheet of, e.g. tinplated iron or brass respectively of several hundredths or tenths of a mm thick. A granular dielectric material slice is located between the two plates and the sandwich heated to soften the dielectric. Pressure is then applied across the sandwich while heated to reduce the thickness to several tens of microns and thus produced sandwiches stacked to provide a capacitor. Iron has the advantage of a relatively low thermal conductivity which aids soldering on printed circuit boards, and a high specific heat and is also a magnetic material. This last point enables the plates to be retained accurately in position and avoid slippage by the use of electromagnets when pressure is applied to the sandwich. Thus the accuracy of the formed capacitance is reasonably assured. Control is also obtained by applying pressure using a servomotor controlled in accordance with the capacitance measured across the plates.</p>
申请公布号 FR2447085(A1) 申请公布日期 1980.08.14
申请号 FR19790001313 申请日期 1979.01.19
申请人 DEGUELDRE ANDRE 发明人
分类号 H01G4/30;(IPC1-7):01G13/00;01G4/14 主分类号 H01G4/30
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