| 摘要 |
PURPOSE:To remove a defect in a partial plating method, and to manufacture a high-density printed wiring board stably by combining a solder resist for plating resistance and a photo-resist. CONSTITUTION:When a solder resist is printed onto a high-density printed wiring board with a mini-via through-hole, a board resin and a solder resist resin have characteristics of no peeling because of mutual resins on the resins even when a photosensitive solder resist (a photo-printing method) is employed. That is, a plating-resistant solder resist is formed, shaping a clearance to the mini-via through-hole, etc., and the photosensitive solder resist is formed so as to be brought into contact with the mini-via through-hole, etc. with positional accuracy by using the photosensitive solder resist. Accordingly, the thickness of a conductor is equalized, and plating thickness is thinned, thus improving the printability of the solder resist, then stably manufacturing the high-density printed wiring board. |
