| 摘要 |
PURPOSE:To enhance bonding accuracy by sensing the position of the tip of thin metal wire to be bonded, and using the variation from the reference position as one of the parameters for compensating the bonding position. CONSTITUTION:Clamps 2 having a protruded bonding wire 1 at the tip of said clamps 2 is provided under a bonding tool 3 which moves up and down so that said clamps 2 is inclined by 45 deg. with respect to an axis 4 along which the tool 3 moves up and down. The wire 1 is compressed to the electrode of the semiconductor element in a package which is arranged under the clamps 2, ane the wire 1 and the electrode is connected by descending the tool 3 and by thermal compression. In this constitution, a lamp 5, a lens 6, and a light-receiving element 7 are provided on both sides of the tip of the wire 1 so that they are inclined by 45 deg. with respect to the axial line, that is, perpendicular to the wire 1. In this way, an enlarged real image 8 of said wire 1 is focussed on a matrix-shaped minute opto-electronic conversion element 10 provided on a light-receiving plane 9 of said element 7, and the bonding position is adjusted by using said image. |
