| 摘要 |
PURPOSE:To get rid of cracks which might occur at bonding neck part by bringing capillary obliquely upward at the time of raising capillary after performing No.1 bonding with element in wire bonding process. CONSTITUTION:After placing capillary 12 in upward position of electrode part of element 13, capillary is lowered and wire 11 is contacted with electrode part and No.1 bonding is performed. Next, after capillary 12 is raised obliquely upward making angle theta which is formed by wire 11, being kept obliquely, and upper surface of element 13, wire 11 is connected with outer guided lead 15 by No.2 bonding. As capillary is moved obliquely upward after No.1 bonding of wire, no bending strength is given at No.1 bonding part and accordingly, deterioration in bonding intensity is prevented from occurrence. |
