DICHTUNGSGLASMASSE

摘要

A sealing glass composition containing refractory filler of lower coefficient of thermal expansion for use in sealing alumina package for electronic components is disclosed. The composition consists essentially of low melting glass powder and cordierite powder in proportion of 2-30% by weight of the total composition, and optionally, beta -eucryptite, beta -spodumen, lead titanate or zircon in a proportion, respectively, not exceeding 15% by weight of the total composition. The low melting glass has a composition of 77.0-86.0 wt. % of PbO, 6.0-15.0 wt. % of B2O3, 0.5-6.9 wt. % of ZnO, 0.1-3.0 wt. % of SiO2, 0-3.0% of Al2O30-2.0% of alkali earth metal oxide, 0-1.5% of SnO2 and 0-1.0% of alkali metal oxide.