| 摘要 |
A power semiconductor device package is made using a subassembly of a die mount substrate and a lead frame. The subassembly is interlocked in a manner that permits relative movement without losing alignment. A method is described in which the lead frame interlock has a first position to facilitate making electrical interconnections. In a second position, package encapsulation is facilitated. In a preferred embodiment the lead frame interlocks with an element lightly press fitted in package mount holes in the die mount substrate. After package encapsulation, the interlock element is pressed out of the substrate to separate unused parts of the lead frame from the package and to make the substrate holes available for package mount.
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