| 摘要 |
PURPOSE:To eliminate the adverse effection of light to an element except photocell portion in a semiconductor device with the photocell by forming light shielding metal film on the element except the photocell portion on a final protecting insulating film and then molding it with transparent resin. CONSTITUTION:A photocell 12 is formed on part of a chip 11 on a lead wire 10. The photocell 12 and the chip 11 are coated with a protecting film 13, and cutouts are formed at the film 13. Aluminum deposited film 14, 15 are formed on the portion except the photocell portion 12 to thereby form a light shielding film. Lead wires 16, 17 are connected directly or throught light shielding films 14, 15 to the chip 11, and connected at the other ends to the lead wires 10, 18, respectively. The lead wires 10, 18 are partially exposed and molded with transparent resin 19. Thus, detrimental light is simply and accurately shielded. |
