| 摘要 |
<p>PURPOSE:To simplify manufacturing process by enabling perfect arrangement of polarity and assembly using magnetic material for one of the leads. CONSTITUTION:Nickel-metalized layer 2 and bump electrode of silver are formed on one principal surface and the other principal surface of semiconductor sabstrate respectively. Lead 4 shall be Dumet wire and magnetized, and semiconductor substrate 1 is adhered on heat sink 4a with nickel-metalized layer 2 placed right under the said substrate. Glass casing is placed over and heat sink 5a with the lead 5 is inserted and sealed. If the principal surface of semiconductor substrate and the lead are predetermined in accordance with the polarity of semiconductor base, it is possible to simplify manufacturing process by performing an assembly with polarity perfectly arranged.</p> |
