发明名称 THERMOPLASTIC MOLDING COMPOSITIONS
摘要 Thermoplastic molding composition having improved physical properties and comprising an intimate admixture of a high molecular weight polyester, from about 0.1 to about 25% by weight, based on the total composition, of a copolymer of ethylene and vinyl acetate and a filler, said composition having been prepared by melt blending the polyester, the copolymer and the filler and further reacting the resultant blend in the solid state.
申请公布号 WO8001385(A1) 申请公布日期 1980.07.10
申请号 WO1979US01066 申请日期 1979.12.10
申请人 GENERAL ELECTRIC CO 发明人 BORMAN W;CAMPBELL R
分类号 C08K3/22;C08K3/36;C08L23/04;C08L31/04;C08L67/00;C08L67/02;(IPC1-7):08L67/02 主分类号 C08K3/22
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