| 摘要 |
PURPOSE:To obtain a piezoelectric device of thin case structure by installing a piezoelectric element in a case of a dual in-line package DIP type. CONSTITUTION:Two three-terminal type piezoelectric elements 23 are connected in series via capacitor 120 to constitude a compound filter, which is installed in DIP. Printed substrate 110 meets flank part 11 of DIP and from two opposing flanks of the flank parts, lead wires 112-115 are projected. On both surfaces of printed substrate 110, electrodes are provided respectively and then connected to lead wires. Capacitor 120 is installed in a hole provided in substrate 110 and on top and reverse surfaces of substrate 110, elastic sheet 82, piezoelectric element 23, upper cover 121, and lower cover 122 are stacked in sequence. The electrode of capacitor 120 is connected to dot electrode 24 of element 23 via elastic sheet 82, and ring electrode 25 and earth electrode 26 are connected to lead wires via the elastic sheet. Consequently, a thin piezoelectric device can be obtained and fabrication efficiency improves. |
