| 摘要 |
The semi conductor casing is constructed to provide thermal and mechanical resistance. By flowing resin around anchor points the resin body is prevented from detaching itself from the metallic base plate. A semiconductor casing comprises a metallic base plate (2) to which a slice (6) of semiconductor material is attached. Metalic terminals (8) are connected to the slice by junction wires (10). The semiconductor slice is surrounded by a body (4) of synthetic resin by injection moulding. This is maintained in posn. by two mushroom shaped protrusions (14) on the metallic base plate. The profiled heads prevent thermal and mechanical condition from lifting the body from the plate or from causing it to slide. |
