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发明名称
Verfahren zum Kontaktieren eines Halbleiterbauelementes
摘要
申请公布号
DE1273697(B)
申请公布日期
1968.07.25
申请号
DE1963T026371
申请日期
1963.08.01
申请人
TELEFUNKEN PATENTVERWERTUNGSGESELLSCHAFT M.B.H.
发明人
DAHLBERG DIPL.-PHYS. DR. REINHARD
分类号
H01L23/29;H01L23/488
主分类号
H01L23/29
代理机构
代理人
主权项
地址
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