| 摘要 |
<p>PURPOSE:To avoid damaging chips when cracking them, and further, arrange and adhere the cut chips at appropriate intervals on a plastic film. CONSTITUTION:The surface without scribed grooves 2 of a silicon substrate 1 is adhered to a plastic film 3 and the film is fixed to a cover 4, a film 7 of the same material is fixed to a jig 6 and the cover and the jig with the films are mounted on a pressure reducing jig 11 one over the other. Evacuating air between the films 3 and 7 first from 12 and then introducing air from 10, the two films are vacuum adhered. Next, being placed on a jig 13 with the grooves 2 downwards and pressed with a roller 14, chips 16 are packed between the two films at prescribed intervals without being damaged. Next, they are placed on a vacuum chuck 17 with the cover 4 downwards and after the film 3 is absorbed onto a filter 18, the surface of the film 7 is heated by infrared rays 19, etc., while air is introduced fom 12, then, the film 7 peels off from the surface of the chips 16. Next, the film 3 is removed from the chuck 17. By so constructing, the yield and the reliability of the device are improved and automatic assembly is enabled.</p> |
