发明名称 SCRIBING METHOD AND APPARATUS THEREFOR
摘要 <p>PURPOSE:To allow a crystal to crack perpendicularly different from the directional property of the crystal by applying ultrasonic vibration to a cutter of scribing work to thereby introduce strain into the interior of the crystal. CONSTITUTION:An ultrasonic vibrating current is applied through lead wires 20a to an ultrasonic horn 20 to thereby expand the magnetostrictive vibration thereof via the horn 20 to transmit it to a cutter 21 fixed via screws 22 to the end of the horn 20. The horn 20 is so constructed as to be supported by a pivot 23 and to be rotatable around a pivotal shaft as a center to apply the load applied to the end of the cutter 21 via a compression spring 24. Thus, the strain cauded by the cutter 21 due to the ultrasonic vibration is transmitted to the deep portion in a crystal to cause the pellet 9 to become in cross section perpendicular regardless of the crystalline orientation after being breaked. The ultrasonic wave may also be applied to a workpiece instead of the cutter. The ultrasonic wave may also be used for scribing the polycrystal or glass scribing process.</p>
申请公布号 JPS5570044(A) 申请公布日期 1980.05.27
申请号 JP19780143351 申请日期 1978.11.22
申请人 HITACHI LTD;HITACHI OME ELECTRONIC CO 发明人 YOSHIDA HISASHI
分类号 H01L21/301;H01L21/78 主分类号 H01L21/301
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