| 摘要 |
PURPOSE:To lower the resistance of conductor portions while eliminating solder encroaching properties, by forming multilayer wiring and circuit elements by means of printing, by coating a circuit element portion with glass, etc. and by plating the upper portions of conductor portions with copper by soaking a substrate in a chemical plating liquid. CONSTITUTION:Circuit elements, such as, a resistor 5, etc. are made up in such a manner that a lower conductor 2, an insulator 3 and an upper conductor 4 are built up on an insulating substrate 1 in alumina, etc. by means of the printing and baking of Ag-Pd paste and borosilicate lead glass, and ruthenium oxide resistance paste, etc. are printed and baked. A circuit element 5 portion is coated with glass or resin 7, and the portions, which are not covered with insulators 7, 3, of the upper conductor 4 and the lower conductor 2 are plated with copper 8 by immersing the substrate 1 in a chemical copper plating liquid. Thus, the impedance of the conductor portions 2, 4 is lowered while solder encroaching properties are eliminated, solder moistening properties are bettered, the connection of parts by means of soldering is made possible and an integrating degree can be improved. |
