发明名称 |
Multilayer substrate for semiconductor chip esp. integrated circuit - with conducting zones sepd. by insulating layers |
摘要 |
<p>Semiconductor device has a multilayer substrate with semiconducting and electrically conducting zone(s) and insulating layer(s). A semiconductor chip, esp. an integrated circuit, is placed on this substrate and has electrical connections to the conducting zone. Mass prodn. of these substrates with controlled high reliability is possible by conventional methods of mfr.</p> |
申请公布号 |
DE2945385(A1) |
申请公布日期 |
1980.05.14 |
申请号 |
DE19792945385 |
申请日期 |
1979.11.09 |
申请人 |
MARUMAN INTEGRATED CIRCUITS,INC. |
发明人 |
DAN IZUMI,HIDEKI |
分类号 |
H01L23/12;H01L23/13;H01L23/14;H01L23/538;H01L25/16;(IPC1-7):01L23/48;01L27/12 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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