发明名称 Multilayer substrate for semiconductor chip esp. integrated circuit - with conducting zones sepd. by insulating layers
摘要 <p>Semiconductor device has a multilayer substrate with semiconducting and electrically conducting zone(s) and insulating layer(s). A semiconductor chip, esp. an integrated circuit, is placed on this substrate and has electrical connections to the conducting zone. Mass prodn. of these substrates with controlled high reliability is possible by conventional methods of mfr.</p>
申请公布号 DE2945385(A1) 申请公布日期 1980.05.14
申请号 DE19792945385 申请日期 1979.11.09
申请人 MARUMAN INTEGRATED CIRCUITS,INC. 发明人 DAN IZUMI,HIDEKI
分类号 H01L23/12;H01L23/13;H01L23/14;H01L23/538;H01L25/16;(IPC1-7):01L23/48;01L27/12 主分类号 H01L23/12
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