| 摘要 |
PURPOSE:To obtain the product which does not fly during soldering work by pouring and solidifying the solder alloy which has been subjected to degassing by being melted under reduced pressure. CONSTITUTION:Molten metal of Sn/Pb base solder alloy is put in a pressure reducing device to sufficiently remove dissolved gas. After this it is poured in molds and is cooled to solidfy. The resultant solder product has an extremely increased rate of elongation, has improved spreading and wetting at the time of soldering and prevents flying phenomenon. |
