TIN-GOLD ELECTROPLATING BATH AND PROCESS

摘要

TIN-GOLD ELECTROPLATING BATH AND PROCESS Disclosed is an aqueous electroplating bath suitable for plating a tin gold alloy and a process of plating employing that bath. The bath contains gold as the auricyanide complex and tin as a stannic halide complex. The bath is operated at a pH value not in excess of 3. Where desired, the bath also contains a brightener. The electroplating bath is extremely stable and produces high quality electrodeposits.