| 摘要 |
PURPOSE:To make complete and smooth joining possible through plastic work by coating the surface of a gold solder material with gold. CONSTITUTION:As a gold solder material casted into a plate or rod shape, one of Au-Sn alloy, Au-Ge alloy and Au-Si alloy is temporarily heated to break casting structure for homogenizing. Next, its surface, after being cleaned by chemical polishing, is plated with gold to a gold coating thickness of 0.5-5mum by electroplating. By ordinary rolling and wiredrawing, a plate gold solder material is made into a thin tape while rod one is into a thin wire, and gold solder with a gold surface layer can be obtained through plastic work. |
