| 摘要 |
<p>1294623 Housing semiconductor devices SIEMENS AG 3 June 1971 [4 June 1970] 18752/71 Heading H1K A semiconductor diode 5 is enclosed by a housing comprising base and wall portions 2, 3 of copper, a synthetic resin cover 9 with a dependent skirt 15, and synthetic resin encapsulant 11. The lower face of the skirt 15 is held in sealing contact with the base 2 by internal lugs 10, and further pressure and external seating is provided by the pressure moulded encapsulant 11. The device shown has a non-bonded electrode assembly held under pressure by the internal spring 8 but, particularly for the case in which the assembly is soldered, (additionally or as an. alternative) the lower faces of the lugs are made parallel to the cover to allow slight lateral freedom of movement during manufacture. The base is knurled (13) so that it may be pushed into a hole in a heat sink or other mount.</p> |
