发明名称 |
Apparatus for aligning and soldering multiple electrode pedestals to the solderable ohmic contacts of semiconductor components |
摘要 |
An apparatus for aligning and soldering electrode pedestals to the solderable ohmic contacts of individual semiconductor components formed by an undivided silicon wafer. The apparatus includes a soldering assembly for receiving the undivided silicon wafer and for temporarily retaining the electrode pedestals in alignment on the silicon wafer during the soldering of the pedestals to the ohmic contacts; a pedestal mask which is placed over the undivided silicon wafer and which aligns individual pedestals over the ohmic contacts of the silicon wafer; and a shaker apparatus coupled to said soldering base plate for distributing the electrode pedestals to each of the ohmic contacts.
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申请公布号 |
US4194668(A) |
申请公布日期 |
1980.03.25 |
申请号 |
US19770858340 |
申请日期 |
1977.12.07 |
申请人 |
BBC BROWN BOVERI & CO LTD |
发明人 |
AKYUREK, ALTAN |
分类号 |
H01L21/52;H01L21/60;H01L23/485;(IPC1-7):B23K1/12 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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