发明名称 |
HEAT TRANSFER MECHANISM FOR INTEGRATED CIRCUIT PACKAGE |
摘要 |
<p>HEAT TRANSFER MECHANISM FOR INTEGRATED CIRCUIT PACKAGE Heat is removed from silicon devices in an integrated circuit package by means of a thermal liquid material contained in a film mounted on the underside of a cover enclosing the integrated circuit device. The film is electrically non-conductive and the film with the enclosed thermal liquid material form a formable pillow such that after the chip/substrate are assembled, the cover with the film containing the thermal liquid material is placed over the substrate and sealed thereto in a manner such that the film comes into direct contact with the top of the chips mounted on the substrate. This provides a direct heat transfer from the chip through the film to the thermal liquid material out to the cover, which may be formed as a heat radiator.</p> |
申请公布号 |
CA1073555(A) |
申请公布日期 |
1980.03.11 |
申请号 |
CA19770287349 |
申请日期 |
1977.09.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SPAIGHT, RONALD N. |
分类号 |
H05K7/20;H01L23/12;H01L23/28;H01L23/34;H01L23/367;H01L23/373;H01L23/42;(IPC1-7):05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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