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发明名称
THERMAL PRESSURE ADHESION DIFFUSION BONDING METHOD
摘要
申请公布号
JPS5533890(A)
申请公布日期
1980.03.10
申请号
JP19790092713
申请日期
1979.07.23
申请人
GEN ELECTRIC
发明人
DAGURASU YUUJIN HOOSUTON;JIEIMUZU ANSONII RAFURAN
分类号
B23K20/00;B23K20/02
主分类号
B23K20/00
代理机构
代理人
主权项
地址
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