发明名称 MANUFACTURING ELECTRODE SUBSTRATUM
摘要 PURPOSE:To prevent falling-off of an active material from an electrode substratum and to prevent cracking and collapsing of a cylindrical electrode by applying metal plating on a foamed layer of a synthetic resin adhered to a multiperforated conductive thin plate. CONSTITUTION:A foamed resin, such as polyurethane or polystyrene, is bonded by adhesion or fusion on a multi-perforated metallic plate, such as a screen, a perforated plate or an expanded metal plate. The foamed resin layer is then subjected to electrolytic plating after electroless plating, washing, drying and heat treatment to remove the foamed resin layer, thus producing an electrode substratum consisting of a cored foamed metal.
申请公布号 JPS5532377(A) 申请公布日期 1980.03.07
申请号 JP19780106154 申请日期 1978.08.29
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 ODA SENNOSUKE;IWAKI TSUTOMU
分类号 H01M4/66;H01M4/80;H01M4/82 主分类号 H01M4/66
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