发明名称 Method of manufacturing PN junctions in a semiconductor region to reach an isolation layer without exposing the semiconductor region surface
摘要 In a semiconductor device including at least one active semiconductor region isolated by an oxide layer in a semiconductor substrate having a principal surface, at least two PN junctions, terminating at the oxide layer, are formed in the active region, by introduction of impurities into the active region with the active region surface never exposed during their formation. The junctions may partly reach the principal surface. The impurities may be introduced by ion implantation through a thin oxide film overlying the active region, and through use of other films placed on the oxide film, or by the known melt-through technique. At least one junction may be formed by epitaxial growth of a semiconductor layer of the opposite conductivity type.
申请公布号 US4191595(A) 申请公布日期 1980.03.04
申请号 US19770835328 申请日期 1977.09.21
申请人 NIPPON ELECTRIC CO LTD 发明人 AOMURA, KUNIO;NAKAMAE, MASAHIKO;TOKUYOSHI, FUJIKI
分类号 H01L21/70;H01L21/033;H01L21/265;H01L21/3115;H01L21/76;H01L21/762;(IPC1-7):H01L29/72;H01L21/22 主分类号 H01L21/70
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