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发明名称
HEAT TREATMENT METHOD OF SEMICONDUCTOR WAFER
摘要
申请公布号
JPS5530806(A)
申请公布日期
1980.03.04
申请号
JP19780102719
申请日期
1978.08.25
申请人
HITACHI LTD
发明人
AOSHIMA TAKAAKI
分类号
H01L21/205;H01L21/18;H01L21/20;H01L21/22
主分类号
H01L21/205
代理机构
代理人
主权项
地址
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