| 摘要 |
Holding composition comprising from 10 to 50 wt.% of the polycondenation product of 2,2'-bis(4-hydroxycyclohoxyl) propane or a halogenated derivative thereof, and maleic or fumaric acid, having a molting point above 70.degree.C, an acid value of less than 50 and Gardner viscusity from Y to Z3, from 0.2 to 2wt.% of an organic peroxide which decomposes at a temperature above 70.degree.C, and an inert filler. The resulting molded articles are particularly useful in the electrical and electronic fields. |
