发明名称 THERMAL ADHESION METHOD OF POLYAMIDE FILM
摘要 PURPOSE:Water is present between the polyamide films and heating seal is effected in the temperature less than fusing point of the film. By doing so, low temperature adhesion can be attained without using any adhesive. Thus, good appearance can be maintained and heat damage of the film can be prevented. CONSTITUTION:Between the films of polyamide to be sealed for extension, a volume of water to get wet the film surface uniformly is present. Then, heating seal or impluse seal in the temperature less than film fusing point Tm, preferrably in the range of (Tm-60)-(Tm-10) deg.C, is effected to do the thermal adhesion of the film. EFFECT:The production of pin hole and so on is not observed more in the sealed part.
申请公布号 JPS5527283(A) 申请公布日期 1980.02.27
申请号 JP19780101274 申请日期 1978.08.18
申请人 发明人
分类号 B29C53/00;B29C65/00;B29C65/18 主分类号 B29C53/00
代理机构 代理人
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