发明名称 Low cost assembly processes for non-linear resistors and ceramic capacitors
摘要 A brazing operation, using a silver-copper alloy preform in a temperature range of from 800 DEG C. to 1100 DEG C., is employed to attach either radial or axial conductive leads to ceramic non-linear resistors or capacitors, thereby eliminating the necessity of titanium-silver vacuum deposition or conductive cermet application prior to lead attachment. Glass encapsulation may be accomplished simultaneous with the brazing operation to further reduce cost.
申请公布号 US4189084(A) 申请公布日期 1980.02.19
申请号 US19780916326 申请日期 1978.06.15
申请人 MOTOROLA INC 发明人 JOHNSON, BARRY C;PELLECHIA, VINCENT J
分类号 H01C1/144;H01C1/146;H01G2/12;(IPC1-7):H01B1/08 主分类号 H01C1/144
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