发明名称 POLYAMIDE RESIN COMPOSITION
摘要 PURPOSE:To obtain a resin composition having excellent hot strength and thermal aging resistance, comprising a polyamide consisting of xylylenediamine and an alpha,omega-straight-chain aliphatic dibasic acid, nylon 66, powdery thermosetting resin having specific particle diameter and glass fibers. CONSTITUTION:(A) 100 pts.wt. mixture of A1: 20-99 pts.wt. polyamide resin obtained from xylylenediamine (>=60% m-xylylenediamine) and an alpha,beta-straight- chain aliphatic dibasic acid (preferably adipic acid or sebasic acid) and A2: 80-1 pts.wt. nylon 66 is blended with (B) 5-85 pts.wt., preferably 10-50 pts.wt. powdery thermosetting resin (preferably phenolic resin or xylene resin, especially phenolic resin containing 0.5-10 wt.% methylol group) having 1-800mum, preferably 1-10mum particle diameter and (C) 5-300 pts.wt., preferably 10-250 pts.wt. glass fibers to give a resin composition.
申请公布号 JPH01272662(A) 申请公布日期 1989.10.31
申请号 JP19880100293 申请日期 1988.04.25
申请人 MITSUBISHI GAS CHEM CO INC 发明人 NOMURA ISAO;YAMAMIYA KAZUO
分类号 C08L77/08;C08K7/14;C08L77/00 主分类号 C08L77/08
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