Component mounting system on circuit board - involves placing components in correct places above circuit board, and their leads are sucked into holes by air stream

摘要

Contact leads of components are arranged symmetrically in two rows. The components are placed in correct positions on the circuit board by a program controll insertion device. The components (1) are so placed in the required positions above the circuit board (4), that free ends of their leads (2) are at a distance of about 1 mm above the circuit board (4) surface. The components (1) are then released from the insertion device and the leads (2) are sucked into the holes (5) by an air stream.