| 摘要 |
<p>SILICON WAFER POLISHING The polishing of monocrystalline silicon wafers with an aqueous composition of fine sized abrasive particles, a soluble alkali metal base such as sodium carbonate and an oxidizing agent such as sodium or potassium salt of dichloroisocyanuric acid (e.g. salts of halo-trizenetrione).</p> |
