| 摘要 |
PURPOSE:To economically perform the high density assembly and a variety of circuit functions of an integrated circuit device by fixedly carrying electronic parts at part of lead drames and superimposing a plurality of such lead frames to seal the parts in resin. CONSTITUTION:Electronic parts 1a, 1b such as IC chips or the like are fixedly carried via adhesives 4a, 4b onto parts of lead drames 3a, 3b. The electrodes 5a1, 5a2,... 5b1, 5b2,.. of the respective electronic parts 1a, 1b are connected to parts of corresponding leads 2a1, 2a2,.., 2b1, 2b2,.. via wires 6. Then, superimposed lead frames 3a, 3b are sealed with resin 7. Then, the lead frames 3a, 3b are cut, and the leads 2a, 2b are bent or the like. As a result, it can perform economically the high density assembly and a variety of circuit functions of such an integrated circuit device which cannot be carried out in the conventional semiconductor IC and respective parts combination or hybrid IC or the like. |
