发明名称 METHOD FOR MANUFACTURING LEADFRAME FOR SEMICONDUCTOR APPARATUS
摘要 PURPOSE:To manufacture various kinds of frame by using single molding system so as to lower the cost by composing molding for drawing leadframe in common components and uncommon components separately and attaching releasably uncommon components to press die set. CONSTITUTION:When various kinds of I.C. leadframe having 24, 22, 20 and so on of external leads are drawn from the molding, common components and uncommon components are separately manufactured and the uncommon componets are selectively assembled with the common comonents. The common components include internal lead parts 11, 12 and external lead parts 21, 22 positioned in extreme outer end, while uncommon components include the parts shown as A-H. Thus, molding for forming the common components is settled to press die set and likewise uncommon components are selectively settled to the press die set and the both components are used in unity. Such constitution evades necessity of providing each separate molding and lowers the cost.
申请公布号 JPS5515292(A) 申请公布日期 1980.02.02
申请号 JP19780089083 申请日期 1978.07.20
申请人 发明人
分类号 H01L23/50;H01L23/495 主分类号 H01L23/50
代理机构 代理人
主权项
地址