PROCESSO PER FABBRICARE SUBSTRATI STABILIZZATI PER PANNELLI A CIRCUIT TO STAMPATO

摘要

A process for stabilizing printed circuit board substrate or laminate through application of a number of laminate conditioning and baking cycles which function to provide the laminates with dimensional stability. This enables greater control and more precise drilling of the laminates in subsequent fabrication and assembly operations. The dimensional stability for a substrate becomes more critical as the substrate size is increased.