发明名称 RESIN SEALING DEVICE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To obtain the resin sealing device for semiconductor element with which the driving direction of a plunger can be properly determined by a method wherein reciprocatory driving force is transmitted to the plunger using a flexible transfer member. CONSTITUTION:When the external bottom force 46 is coupled to the top force, an AC servo motor 22 is driven, and a ball screw shaft 33 is rotated through the intermediary of a coupling 32. A nut 39 advances in accordance with the rotation of the ball screw shaft 33. Consequently, a rod 40 is displaced into a sliding path 45a, and a plunger 43 is moved up by a chain 41. Then, a tablet 16 is press-inserted into the external bottom force 46 and the top force through the intermediary of the plunger 43. The direction of displacement of the plunger 43 can be brought to a suitable angle by properly setting the measurements of the circular arc of the chain 41 for the displacement in horizontal direction of the nut 39.
申请公布号 JPS62287630(A) 申请公布日期 1987.12.14
申请号 JP19860132136 申请日期 1986.06.05
申请人 MITSUBISHI ELECTRIC CORP 发明人 TANAKA MINORU
分类号 H01L21/56;B29C45/02;B29C45/53;F16H49/00 主分类号 H01L21/56
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