发明名称 METHOD DI PLACCATURA METALLICA PER RIDUZIONE
摘要 An aqueous method for the selective metallization of a non-conductive surface with nickel, copper, cobalt, or gold, a thin film of palladium dichloride is applied to a film after stannous chloride, a chelating agent and a dye operative as a catalyzing promoter active to a light between 4,500 A and 6,000 A or broadly 3,750 to 8,000 A are applied to the surface of a non-conductive material and that thin film is exposed in selected areas to light through a photographic negative to a light of a wave length determined by the dye. The thin film of the palladium salt, catalytic to the deposition of nickel, copper, cobalt, or gold from an electroless bath thereof causes selective deposition when the thus treated non-conductive material is then immersed in an electroless bath to metallize the areas which have been rendered catalytic by the action of dye and chelating agent in combination with the palladium salt. The preferred dye is Erythrosin dye and the chelating agent is orthopenanthroline.
申请公布号 IT1042746(B) 申请公布日期 1980.01.30
申请号 IT19750027554 申请日期 1975.09.23
申请人 AMP INC 发明人
分类号 C23C18/16;C23C18/28;G03C5/58;H05K3/18;(IPC1-7):C23C/ 主分类号 C23C18/16
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