| 摘要 |
PURPOSE:To relax the stress due to the thermal expansion difference between a frame and elements and prevent breakdown in the elements, by providing partial cuts on the island of a lead frame which is provided with an island on which semiconductor elements are mounted and a plurality of external leads. CONSTITUTION:Cross-shaped cut 12 is provided on island 11, for mounting semiconductor elements, of a lead frame having a plurality of leads. by this, when the stress due to the thermal expansion difference produced when semiconductor elements are fixed on island 11 becomes l1/l, where l represents the width of the island and l1 represents the distance from the cut part to the outer edge. Since this stress is applied to the elements, they are prevented from breakdown. Also, cuts 22 and 23 parallel to the island, instead of the corss-shaped cut, may be used. |
