| 摘要 |
<p>PURPOSE:To dispense with mounting and reduce cost by hanging a semi-conductor chip by the bonding strength of wire bonding alone and then moulding the chip. CONSTITUTION:A semi-conductor chip 4 is hanged in a device hole of a circuit board 5 being fixed only by the strength of wire bonding until it is moulded. Then it is fixed being moulded with moulding material 6. As the bonding strength is about eight grams per bond, many bonds can sufficiently support the weight of the semi- conductor chip. A problem of handling until moulding can be solved by preparing a transferring jig. By so doing, a chip mounting operation can be dispensed with.</p> |
