Thermochemical coating of copper onto substrates - esp. oxidisable metals or refractory materials using copper cyanide

摘要

Substrate is coated with Cu copper by (a) contacting it with CuCn; (b) enclosing it with the CuCN in a box; and (c) heating the box to a temp at which the CuCN vaporises and decomposes to form a Cu deposit. Method is esp. useful for coating metals which easily form a refractory oxide surface film (e.g. Ti (alloys), Ta (alloys), Nb (alloys), Zr (alloys) and Cr-Ni stainless steels), metals which are difficult to electroplate (e.g. Mo (alloys) and W (alloys), refractory metal oxides (e.g. alumina and vitreous silica) and certain C and carbide based refractories. Thick (e.g. about 10 mu), adherent Cu coatings can be produced.