| 摘要 |
PURPOSE: To provide a semiconductor wafer cleaning system for removing contaminant from the surface of one semiconductor wafer at one time with megasonic or high frequency energy. CONSTITUTION: A wafer 10 is vertically held by a holder 60 inside a container 20 formed so as to strengthen megasonic or high frequency energy near the wafer surface through a cleaning liquid. On the bottom of the container, an energy generator 30 is attached. The cleaning liquid is injected from piping on the bottom into the container 20 and overflows its upper part. Besides, the contaminated cleaning liquid is discharged from the piping on the bottom. When cleaning is finished, a rinsing process is started and a rinse fluid is injected into the container 20. When rinsing is finished, infrared, visible or ultraviolet electromagnetic fields are generated from a shielding body parallel to the side wall of the upper part of container, and the wafer 10 is dried by that energy. During the respective processes, the wafer 10 is rotated by a rotator so that uniform work can be performed.
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